BGM13HBA9E6327XTSA1 Vidiny (USD) [321466pcs Stock]
- 1 pcs$0.11563
- 4,500 pcs$0.11506
- Ampahany:
- BGM13HBA9E6327XTSA1
- Manufacturer:
- Infineon Technologies
- Famaritana antsipirihany:
- MULTI CHIP MODULES.
- Manufacturer's standard lead time:
- Ao amin'ny staoky
- Fiainana an-trano:
- Iray taona
- Chip From:
- Hong Kong
- RoHS:
- Fomba fandoavam-bola:
-
- Fomba fandefasana:
- Fianakaviana:
- KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Fitaovana RF, RF Shields, RF Power Dividers / Splitters, Modules RF Transceiver, RF Transceiver ICs, RF Antennasy, RFI sy EMI - Fifandraisana, Fingerstock ary Gasket and RF Front End (LNA + PA) ...
- Ny tombony azo amin'ny fifaninanana:
- We specialize in Infineon Technologies BGM13HBA9E6327XTSA1 electronic components. BGM13HBA9E6327XTSA1 can be shipped within 24 hours after order. If you have any demands for BGM13HBA9E6327XTSA1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BGM13HBA9E6327XTSA1 Toetran'ny vokatra
Ampahany :
BGM13HBA9E6327XTSA1
Manufacturer :
Infineon Technologies
Description :
MULTI CHIP MODULES
Series :
-
Ampahany :
Active
Fianakaviana / fenitra RF :
Bluetooth
Protocol :
802.11a/b/g/n, Bluetooth v4.0
Fanovaovam-peo :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Frequency :
1.805GHz ~ 2.69GHz
Data :
54Mbps
Hery - Output :
-
fahatsapana :
-
Fifaneraserana Serial :
SPI, USB
Type Antena :
-
Nampiasa IC / Part :
-
Haben'ny fahatsiarovana :
-
Volonta - Famatsiana :
1.6V ~ 3.1V
Ankehitriny - Mandray :
-
Ankehitriny - Fandefasana :
-
Type Type :
Surface Mount
Ny mari-pana :
-40°C ~ 85°C
Famonosana / tranga :
-
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