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Samsung Semiconductor - K4B4G0846R-BFMA

KEY Part #: K7359685

[17141pcs Stock]

    Ampahany:
    K4B4G0846R-BFMA
    Manufacturer:
    Samsung Semiconductor
    Famaritana antsipirihany:
    4 Gb 512M x 8 1866 Mbps 1.35 V -40 ~ 95 °C 78FBGA Mass Production.
    Manufacturer's standard lead time:
    Ao amin'ny staoky
    Fiainana an-trano:
    Iray taona
    Chip From:
    Hong Kong
    RoHS:
    Fomba fandoavam-bola:
    Fomba fandefasana:
    Fianakaviana:
    KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: SLC Nand, GDDR6, LPDDR5, HBM Aquabolt, LPDDR4X, MODULE, HBM Flarebolt and GDDR5 ...
    Ny tombony azo amin'ny fifaninanana:
    We specialize in Samsung Semiconductor K4B4G0846R-BFMA electronic components. K4B4G0846R-BFMA can be shipped within 24 hours after order. If you have any demands for K4B4G0846R-BFMA, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4B4G0846R-BFMA Toetran'ny vokatra

    Ampahany : K4B4G0846R-BFMA
    Manufacturer : Samsung Semiconductor
    Description : 4 Gb 512M x 8 1866 Mbps 1.35 V -40 ~ 95 °C 78FBGA Mass Production
    Series : DDR3
    hakitroky : 4 Gb
    Org. : 512M x 8
    Speed : 1866 Mbps
    Zintin'aratra : 1.35 V
    Temp. : -40 ~ 95 °C
    Package : 78FBGA
    Product Status : Mass Production

    Vaovao farany

    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Autonomous Driving and the Quest for Safety
    Inside the building blocks of the 5G future
    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
    High Bandwidth Memory is Catching on for Data-intensive Computing
    SSDs, DRAM and gaming: Unlocking a new level of performance
    Unlocking the Power of Cloud Computing
    5G and Memory - from Connected Thinking to Connected Living
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    The future of NAND technology
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards
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