Aavid, Thermal Division of Boyd Corporation - 533101B02551G

KEY Part #: K6234650

533101B02551G Vidiny (USD) [68816pcs Stock]

  • 1 pcs$0.56820
  • 3,750 pcs$0.52548

Ampahany:
533101B02551G
Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Famaritana antsipirihany:
BOARD LEVEL HEAT SINK. Heat Sinks Extruded Style Heatsink for TO-218, Radial Fins, Vertical Mounting, 11 n Thermal Resistance, Black Anodized, 2.67mm Hole, 38.1x21.59x17.02mm
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Thermal - Fitaovana, Epoxies, Greases, Pastes, Thermal - Fahafahana mangatsiaka, Thermal - Pads, Sheets, Fandroana - Fandroana hafanana, Toeram-piainana, Mpankafy - Fitaovana, Thermal - Thermoelectric, Peltier Modules, Thermal - Fitaovana and DC mpankafy ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Aavid, Thermal Division of Boyd Corporation 533101B02551G electronic components. 533101B02551G can be shipped within 24 hours after order. If you have any demands for 533101B02551G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

533101B02551G Toetran'ny vokatra

Ampahany : 533101B02551G
Manufacturer : Aavid, Thermal Division of Boyd Corporation
Description : BOARD LEVEL HEAT SINK
Series : -
Ampahany : Active
Type : Board Level, Vertical
Milamina ny fonosana : TO-218, TO-247
Fomba fampiakarana : Clip and PC Pin
endrika : Rectangular, Fins
Length : 1.500" (38.10mm)
sakany : 1.375" (34.93mm)
savaivony : -
Height off base (Height of Fin) : 0.500" (12.70mm)
Fahafahana herinaratra @ fiakaran'ny hafanana : 8.0W @ 80°C
Fifanampiana @ rano an-tery : 3.00°C/W @ 500 LFM
Fifanampiana @ menaka : 11.00°C/W
Material : Aluminum
Vita ny fitaovana : Black Anodized

Mety ho liana koa ianao
  • 511-3M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x76.2mm

  • 1-1542002-1

    TE Connectivity AMP Connectors

    HEAT SINK BGA 37.5MM 2FIN RADIAL. Heat Sinks 2 Fin Radial 37.5 x 37.5

  • PH3N-101.6-25.4-0.062-1A

    t-Global Technology

    PH3N NANO 101.6X25.4X0.062MM.

  • AH50600V05000FE

    Ohmite

    ALUMINUM EXTRUSION 5. Heat Sinks Alum Extrusion 5" For HS100 Series

  • C264-085-3VE

    Ohmite

    HEATSINK AND CLIPS FOR 3 TO-264. Heat Sinks HEATSINK FOR TO-264 3 CLIPS, NO FINISH

  • 576203B00000G

    Aavid, Thermal Division of Boyd Corporation

    BOARD LEVEL HEAT SINK. Heat Sinks Square Basket Style Board Level Heatsink for TO-3, Slanted Vane Fins, Horizontal Mounting, 6.2 n Thermal Resistance, Black Anodized, 19.05mm