HSF-55-30-B-F Vidiny (USD) [2554pcs Stock]
- 1 pcs$16.95678
- Ampahany:
- HSF-55-30-B-F
- Manufacturer:
- Wakefield-Vette
- Famaritana antsipirihany:
- FANSINK 12VDC 55X55X30.1MM. Heat Sinks Heatsink Fan Combination, 55x55mm, 13.8CFM, 30.1mm Height, 0.70 C/W
- Manufacturer's standard lead time:
- Ao amin'ny staoky
- Fiainana an-trano:
- Iray taona
- Chip From:
- Hong Kong
- RoHS:
- Fomba fandoavam-bola:
-
- Fomba fandefasana:
- Fianakaviana:
- KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Fandroana - Fandroana hafanana, Toeram-piainana, Thermal - Pads, Sheets, Fans AC, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Thermoelectric, Peltier Modules, Thermal - Fitaovana, Mpankafy - Akora - kofehy mpankafy and Thermal - Fitaovana, Epoxies, Greases, Pastes ...
- Ny tombony azo amin'ny fifaninanana:
- We specialize in Wakefield-Vette HSF-55-30-B-F electronic components. HSF-55-30-B-F can be shipped within 24 hours after order. If you have any demands for HSF-55-30-B-F, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HSF-55-30-B-F Toetran'ny vokatra
Ampahany :
HSF-55-30-B-F
Manufacturer :
Wakefield-Vette
Description :
FANSINK 12VDC 55X55X30.1MM
Series :
HSF
Ampahany :
Active
Type :
Top Mount
Milamina ny fonosana :
BGA
Fomba fampiakarana :
Clip
endrika :
Square, Fins
Length :
2.165" (55.00mm)
sakany :
2.165" (55.00mm)
savaivony :
-
Height off base (Height of Fin) :
1.067" (27.10mm)
Fahafahana herinaratra @ fiakaran'ny hafanana :
-
Fifanampiana @ rano an-tery :
-
Fifanampiana @ menaka :
0.70°C/W
Material :
Aluminum Alloy
Vita ny fitaovana :
Black Anodized
Vaovao farany
Mety ho liana koa ianao
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-
-
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x152.4mm
-
511-6M
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x152.4mm
-
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Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 187.452x152.4mm
-
510-14M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x355.6mm
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