t-Global Technology - PC93-24-21.01-3

KEY Part #: K6153185

PC93-24-21.01-3 Vidiny (USD) [83500pcs Stock]

  • 1 pcs$0.46827
  • 10 pcs$0.44611
  • 25 pcs$0.43432
  • 50 pcs$0.42262
  • 100 pcs$0.39916
  • 250 pcs$0.37569
  • 500 pcs$0.33317
  • 1,000 pcs$0.31096
  • 5,000 pcs$0.29985

Ampahany:
PC93-24-21.01-3
Manufacturer:
t-Global Technology
Famaritana antsipirihany:
THERM PAD 24MMX21.01MM GRAY.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Mpankafy - Akora - kofehy mpankafy, Thermal - Fitaovana, Thermal - Fahafahana mangatsiaka, Thermal - Fitaovana, Epoxies, Greases, Pastes, Fans AC, Thermal - Fitaovana, Epoxies, Greases, Pastes, DC mpankafy and Thermal - Thermoelectric, Peltier Modules ...
Ny tombony azo amin'ny fifaninanana:
We specialize in t-Global Technology PC93-24-21.01-3 electronic components. PC93-24-21.01-3 can be shipped within 24 hours after order. If you have any demands for PC93-24-21.01-3, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

PC93-24-21.01-3 Toetran'ny vokatra

Ampahany : PC93-24-21.01-3
Manufacturer : t-Global Technology
Description : THERM PAD 24MMX21.01MM GRAY
Series : PC93
Ampahany : Active
Fampiasana : -
Type : Conductive Pad, Sheet
endrika : Rectangular
drafitra : 24.00mm x 21.01mm
hateviny : 0.118" (3.00mm)
Material : Non-Silicone
Adhesive : -
Mihemotra, mitondra fiara : -
Color : Gray
Famonoan-tena : -
Fitondran-tena mafana : 2.0 W/m-K

Mety ho liana koa ianao
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft