Laird Technologies - Thermal Materials - A15996-05

KEY Part #: K6153169

A15996-05 Vidiny (USD) [830pcs Stock]

  • 1 pcs$56.16471
  • 4 pcs$55.88528

Ampahany:
A15996-05
Manufacturer:
Laird Technologies - Thermal Materials
Famaritana antsipirihany:
THERM PAD 228.6MMX228.6MM GRAY.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Thermal - Fitaovana, Epoxies, Greases, Pastes, Fans AC, Mpankafy - Fitaovana, Thermal - Mangatsiaka hafanana, Thermal - Fitaovana, Thermal - Fitaovana, Epoxies, Greases, Pastes, Mpankafy - Akora - kofehy mpankafy and Thermal - Pads, Sheets ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Laird Technologies - Thermal Materials A15996-05 electronic components. A15996-05 can be shipped within 24 hours after order. If you have any demands for A15996-05, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A15996-05 Toetran'ny vokatra

Ampahany : A15996-05
Manufacturer : Laird Technologies - Thermal Materials
Description : THERM PAD 228.6MMX228.6MM GRAY
Series : Tflex™ 700
Ampahany : Not For New Designs
Fampiasana : -
Type : Gap Filler Pad, Sheet
endrika : Square
drafitra : 228.60mm x 228.60mm
hateviny : 0.0500" (1.270mm)
Material : Silicone
Adhesive : Tacky - One Side
Mihemotra, mitondra fiara : -
Color : Gray
Famonoan-tena : -
Fitondran-tena mafana : 5.0 W/m-K

Mety ho liana koa ianao
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft