Samsung Semiconductor - K4FHE3D4HM-MHCJ

KEY Part #: K7359781

[20140pcs Stock]

Ampahany:: K4FHE3D4HM-MHCJ

Manufacturer:: Samsung Semiconductor

Famaritana antsipirihany:: 24 Gb x32 3733 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 105 °C 200FBGA Mass Production.

Manufacturer's standard lead time:: Ao amin'ny staoky

Fiainana an-trano:: Iray taona

Chip From:: Hong Kong

RoHS:

Fomba fandoavam-bola:

Fomba fandefasana:

Fianakaviana:: KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: SLC Nand, HBM Aquabolt, GDDR5, LPDDR4, LPDDR5, DDR4, LPDDR4X and LPDDR3 ...

Ny tombony azo amin'ny fifaninanana:: We specialize in Samsung Semiconductor K4FHE3D4HM-MHCJ electronic components. K4FHE3D4HM-MHCJ can be shipped within 24 hours after order. If you have any demands for K4FHE3D4HM-MHCJ, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

GB-T-27922

ISO-9001-2015

ISO-13485

ISO-14001

ISO-28000-2007

ISO-45001-2018

K4FHE3D4HM-MHCJ Toetran'ny vokatra

Ampahany : K4FHE3D4HM-MHCJ

Manufacturer : Samsung Semiconductor

Description : 24 Gb x32 3733 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 105 °C 200FBGA Mass Production

Series : DDR3

hakitroky : 24 Gb

Org. : x32

Speed : 3733 Mbps

Zintin'aratra : 1.8 / 1.1 / 1.1 V

Temp. : -40 ~ 105 °C

Package : 200FBGA

Product Status : Mass Production

Vaovao farany

NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters

Inside the building blocks of the 5G future

Samsung Now Producing Four Gigabit LPDDR3 Mobile DRAM, Using 20nm-class Process Technology

Automotive Driven by Small Packages Under the Hood

Samsung Memory Solutions for Automotive

Mass Production of Fifth-Generation V-NAND has Started

Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards

How Will 5G Impact on Memory?

Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones

Samsung Electronics Takes 3D Memory to New Heights with Sixth-generation V-NAND SSDs for Client Computing

Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones

The Ultra-Low Latency SSD, Z-SSD

Mety ho liana koa ianao

M392A2K43BB0-CPB

Samsung Semiconductor

DDR4 VLP RDIMM 16 GB 2R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 18 EOL.
M392A2K43BB0-CRC

Samsung Semiconductor

DDR4 VLP RDIMM 16 GB 2R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 18 EOL.
M392A4K40BM0-CPB

Samsung Semiconductor

DDR4 VLP RDIMM 32 GB 2R x 4 2133 Mbps 1.2 V 288 (DDP4G x 4) x 18 EOL.
M392A4K40BM0-CRC

Samsung Semiconductor

DDR4 VLP RDIMM 32 GB 2R x 4 2400 Mbps 1.2 V 288 (DDP4G x 4) x 18 EOL.
M378A1K43BB1-CPB

Samsung Semiconductor

DDR4 UDIMM 8 GB 1R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.
M378A1K43BB2-CRC

Samsung Semiconductor

DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

Faritra mafana

English malaɡasʲ