Advanced Thermal Solutions Inc. - ATS-H1-15-C2-R0

KEY Part #: K6263804

ATS-H1-15-C2-R0 Vidiny (USD) [9088pcs Stock]

  • 1 pcs$4.25716
  • 10 pcs$4.14214
  • 25 pcs$3.91201
  • 50 pcs$3.68196
  • 100 pcs$3.45183
  • 250 pcs$3.22169
  • 500 pcs$2.99157
  • 1,000 pcs$2.93404

Ampahany:
ATS-H1-15-C2-R0
Manufacturer:
Advanced Thermal Solutions Inc.
Famaritana antsipirihany:
HEATSINK 50X50X25MM XCUT T766.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Fans AC, Thermal - Mangatsiaka hafanana, Fandroana - Fandroana hafanana, Toeram-piainana, Thermal - Pads, Sheets, Thermal - Thermoelectric, Peltier Modules, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Fitaovana, Epoxies, Greases, Pastes and Thermal - Fahafahana mangatsiaka ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Advanced Thermal Solutions Inc. ATS-H1-15-C2-R0 electronic components. ATS-H1-15-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-15-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-H1-15-C2-R0 Toetran'ny vokatra

Ampahany : ATS-H1-15-C2-R0
Manufacturer : Advanced Thermal Solutions Inc.
Description : HEATSINK 50X50X25MM XCUT T766
Series : pushPIN™
Ampahany : Active
Type : Top Mount
Milamina ny fonosana : Assorted (BGA, LGA, CPU, ASIC...)
Fomba fampiakarana : Push Pin
endrika : Square, Fins
Length : 1.969" (50.00mm)
sakany : 1.969" (50.00mm)
savaivony : -
Height off base (Height of Fin) : 0.984" (25.00mm)
Fahafahana herinaratra @ fiakaran'ny hafanana : -
Fifanampiana @ rano an-tery : 7.44°C/W @ 100 LFM
Fifanampiana @ menaka : -
Material : Aluminum
Vita ny fitaovana : Blue Anodized

Mety ho liana koa ianao
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3-50.8-12.7-0.21-1A

    t-Global Technology

    PH3 50.8X12.07X0.21MM.

  • PH3-150-150-0.21-1A

    t-Global Technology

    IR HEAT SPREADER/EMITTER W/ADH.