ATS-H1-20-C2-R0 Vidiny (USD) [8517pcs Stock]
- 1 pcs$4.54362
- 10 pcs$4.42242
- 25 pcs$4.17695
- 50 pcs$3.93122
- 100 pcs$3.68549
- 250 pcs$3.43979
- 500 pcs$3.19409
- 1,000 pcs$3.13266
- Ampahany:
- ATS-H1-20-C2-R0
- Manufacturer:
- Advanced Thermal Solutions Inc.
- Famaritana antsipirihany:
- HEATSINK 54X54X25MM XCUT T766.
- Manufacturer's standard lead time:
- Ao amin'ny staoky
- Fiainana an-trano:
- Iray taona
- Chip From:
- Hong Kong
- RoHS:
- Fomba fandoavam-bola:
-
- Fomba fandefasana:
- Fianakaviana:
- KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Fandroana - Fandroana hafanana, Toeram-piainana, Mpankafy - Fitaovana, DC mpankafy, Thermal - Fitaovana, Epoxies, Greases, Pastes, Thermal - Thermoelectric, Peltier Modules, Thermal - Thermoelectric, Peltier Assemblies, Fans AC and Thermal - Mangatsiaka hafanana ...
- Ny tombony azo amin'ny fifaninanana:
- We specialize in Advanced Thermal Solutions Inc. ATS-H1-20-C2-R0 electronic components. ATS-H1-20-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-20-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-H1-20-C2-R0 Toetran'ny vokatra
Ampahany :
ATS-H1-20-C2-R0
Manufacturer :
Advanced Thermal Solutions Inc.
Description :
HEATSINK 54X54X25MM XCUT T766
Series :
pushPIN™
Ampahany :
Active
Type :
Top Mount
Milamina ny fonosana :
Assorted (BGA, LGA, CPU, ASIC...)
Fomba fampiakarana :
Push Pin
endrika :
Square, Fins
Length :
2.126" (54.01mm)
sakany :
2.126" (54.00mm)
savaivony :
-
Height off base (Height of Fin) :
0.984" (25.00mm)
Fahafahana herinaratra @ fiakaran'ny hafanana :
-
Fifanampiana @ rano an-tery :
7.14°C/W @ 100 LFM
Fifanampiana @ menaka :
-
Material :
Aluminum
Vita ny fitaovana :
Blue Anodized
Vaovao farany
Mety ho liana koa ianao
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
Faritra mafana
- EX457014CB
- 300872
- DV-T263-301E
- 565416-01
- 565414-01
- 565019-01
- DA-T263-201E
- 3-1542011-8
- 4-1542005-3
- 833302B02800
- 821202B00000
- 833900T00000
- 833702T00000
- MHSL15040
- MHSL10025
- MHSL10055
- 624-35ABT4
- 624-25ABT4
- 7-320-BA
- PSC2-2U
- 7-443-01E-BA
- 7-322-BA
- AQP-HS-N40
- 2-1963558-7
- 2-1963557-7
- 2-1963562-5
- 2-1963564-7
- 2-1963558-4
- 1-1963557-4
- 3-1542012-3
- 1-1963563-2
- 2-1963560-2
- 1-1963560-5
- 1-1963560-2
- 2-1963558-3
- 1-1963557-3
- 2-1963553-3
- 39880100060
- 7-1542006-0
- 6-1542001-0