CTS Thermal Management Products - BDN11-3CB/A01

KEY Part #: K6265518

BDN11-3CB/A01 Vidiny (USD) [34131pcs Stock]

  • 1 pcs$1.24277
  • 10 pcs$1.21104
  • 25 pcs$1.17843
  • 50 pcs$1.05579
  • 100 pcs$0.99370
  • 250 pcs$0.93161
  • 500 pcs$0.90055
  • 1,000 pcs$0.80739
  • 5,000 pcs$0.79186

Ampahany:
BDN11-3CB/A01
Manufacturer:
CTS Thermal Management Products
Famaritana antsipirihany:
HEATSINK CPU W/ADHESIVE 1.11SQ.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: DC mpankafy, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Thermoelectric, Peltier Modules, Thermal - Fahafahana mangatsiaka, Mpankafy - Fitaovana, Thermal - Fitaovana, Thermal - Fitaovana, Epoxies, Greases, Pastes and Fandroana - Fandroana hafanana, Toeram-piainana ...
Ny tombony azo amin'ny fifaninanana:
We specialize in CTS Thermal Management Products BDN11-3CB/A01 electronic components. BDN11-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN11-3CB/A01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN11-3CB/A01 Toetran'ny vokatra

Ampahany : BDN11-3CB/A01
Manufacturer : CTS Thermal Management Products
Description : HEATSINK CPU W/ADHESIVE 1.11SQ
Series : BDN
Ampahany : Active
Type : Top Mount
Milamina ny fonosana : Assorted (BGA, LGA, CPU, ASIC...)
Fomba fampiakarana : Thermal Tape, Adhesive (Included)
endrika : Square, Pin Fins
Length : 1.110" (28.19mm)
sakany : 1.110" (28.19mm)
savaivony : -
Height off base (Height of Fin) : 0.355" (9.02mm)
Fahafahana herinaratra @ fiakaran'ny hafanana : -
Fifanampiana @ rano an-tery : 7.20°C/W @ 400 LFM
Fifanampiana @ menaka : 20.90°C/W
Material : Aluminum
Vita ny fitaovana : Black Anodized

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