Ampahany :
67SLG040035030PI00
Manufacturer :
Laird Technologies EMI
Description :
METAL FILM OVER FOAM CONTACTS
Series :
SMD Grounding Metallized
Material :
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Fametahana - matevina :
-
Fomba fampiakarana :
Solder
Ny mari-pana :
-40°C ~ 70°C