Bergquist - SP900S-0.009-00-105

KEY Part #: K6153214

SP900S-0.009-00-105 Vidiny (USD) [137531pcs Stock]

  • 1 pcs$0.26894
  • 10 pcs$0.24086
  • 50 pcs$0.21594
  • 100 pcs$0.19103
  • 500 pcs$0.16611
  • 1,000 pcs$0.12458
  • 5,000 pcs$0.10797

Ampahany:
SP900S-0.009-00-105
Manufacturer:
Bergquist
Famaritana antsipirihany:
THERM PAD 36.83MMX21.29MM PINK. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, 36.83x21.29x15.54x6.22mm, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Se
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: DC mpankafy, Thermal - Fahafahana mangatsiaka, Thermal - Fitaovana, Thermal - Pads, Sheets, Thermal - Mangatsiaka hafanana, Thermal - Thermoelectric, Peltier Modules, Mpankafy - Akora - kofehy mpankafy and Thermal - Fitaovana, Epoxies, Greases, Pastes ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Bergquist SP900S-0.009-00-105 electronic components. SP900S-0.009-00-105 can be shipped within 24 hours after order. If you have any demands for SP900S-0.009-00-105, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP900S-0.009-00-105 Toetran'ny vokatra

Ampahany : SP900S-0.009-00-105
Manufacturer : Bergquist
Description : THERM PAD 36.83MMX21.29MM PINK
Series : Sil-Pad® 900-S
Ampahany : Active
Fampiasana : SIP
Type : Pad, Sheet
endrika : Rectangular
drafitra : 36.83mm x 21.29mm
hateviny : 0.0090" (0.229mm)
Material : Silicone Rubber
Adhesive : -
Mihemotra, mitondra fiara : Fiberglass
Color : Pink
Famonoan-tena : 0.61°C/W
Fitondran-tena mafana : 1.6 W/m-K

Mety ho liana koa ianao
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft

  • 175-6-240P

    Wakefield-Vette

    THERM PAD 19.1MMX12.7MM GRAY. Thermal Interface Products THERMAL INTERFACE PROD TO-220