Advanced Thermal Solutions Inc. - ATS-08G-04-C2-R0

KEY Part #: K6263501

ATS-08G-04-C2-R0 Vidiny (USD) [15986pcs Stock]

  • 1 pcs$2.57809
  • 10 pcs$2.38683
  • 30 pcs$2.32219
  • 50 pcs$2.19319
  • 100 pcs$2.06415
  • 250 pcs$1.93517
  • 500 pcs$1.87066
  • 1,000 pcs$1.67714

Ampahany:
ATS-08G-04-C2-R0
Manufacturer:
Advanced Thermal Solutions Inc.
Famaritana antsipirihany:
HEATSINK 40X40X20MM XCUT T766.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Mpankafy - Akora - kofehy mpankafy, Mpankafy - Fitaovana, Thermal - Fitaovana, Epoxies, Greases, Pastes, Thermal - Pads, Sheets, Thermal - Mangatsiaka hafanana, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Thermoelectric, Peltier Modules and Thermal - Fahafahana mangatsiaka ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Advanced Thermal Solutions Inc. ATS-08G-04-C2-R0 electronic components. ATS-08G-04-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-08G-04-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-08G-04-C2-R0 Toetran'ny vokatra

Ampahany : ATS-08G-04-C2-R0
Manufacturer : Advanced Thermal Solutions Inc.
Description : HEATSINK 40X40X20MM XCUT T766
Series : pushPIN™
Ampahany : Active
Type : Top Mount
Milamina ny fonosana : Assorted (BGA, LGA, CPU, ASIC...)
Fomba fampiakarana : Push Pin
endrika : Square, Fins
Length : 1.575" (40.00mm)
sakany : 1.575" (40.00mm)
savaivony : -
Height off base (Height of Fin) : 0.790" (20.00mm)
Fahafahana herinaratra @ fiakaran'ny hafanana : -
Fifanampiana @ rano an-tery : 11.58°C/W @ 100 LFM
Fifanampiana @ menaka : -
Material : Aluminum
Vita ny fitaovana : Blue Anodized

Mety ho liana koa ianao
  • 511-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm

  • 510-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY.

  • 510-14U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY.

  • 122257

    Wakefield-Vette

    HEATSINK 19275 PROFILE 12. Heat Sinks 19275 Extrusion Profile Cut to 12 Inches, 12x7.4x2.17 Inch, High Aspect Ratio

  • PH3N-76.2-19.1-0.07-1A

    t-Global Technology

    PH3N NANO 76.2X19.1X0.07MM.

  • TG-CJ-60-60-15-PF

    t-Global Technology

    HEATSINK CER 60X60X15MM.