Advanced Thermal Solutions Inc. - ATS-X53210G-C1-R0

KEY Part #: K6263977

ATS-X53210G-C1-R0 Vidiny (USD) [5670pcs Stock]

  • 1 pcs$7.28036
  • 10 pcs$6.87756
  • 25 pcs$6.47300
  • 50 pcs$6.06844

Ampahany:
ATS-X53210G-C1-R0
Manufacturer:
Advanced Thermal Solutions Inc.
Famaritana antsipirihany:
SUPERGRIP HEATSINK 21X21X12.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 21x21x12.5mm
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Mpankafy - Fitaovana, DC mpankafy, Thermal - Pads, Sheets, Thermal - Fitaovana, Epoxies, Greases, Pastes, Mpankafy - Akora - kofehy mpankafy, Thermal - Mangatsiaka hafanana, Thermal - Fitaovana and Thermal - Thermoelectric, Peltier Modules ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Advanced Thermal Solutions Inc. ATS-X53210G-C1-R0 electronic components. ATS-X53210G-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53210G-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-X53210G-C1-R0 Toetran'ny vokatra

Ampahany : ATS-X53210G-C1-R0
Manufacturer : Advanced Thermal Solutions Inc.
Description : SUPERGRIP HEATSINK 21X21X12.5MM
Series : superGRIP™
Ampahany : Active
Type : Top Mount
Milamina ny fonosana : BGA
Fomba fampiakarana : Clip, Thermal Material
endrika : Square, Fins
Length : 0.827" (21.00mm)
sakany : 0.827" (21.00mm)
savaivony : -
Height off base (Height of Fin) : 0.492" (12.50mm)
Fahafahana herinaratra @ fiakaran'ny hafanana : -
Fifanampiana @ rano an-tery : 11.10°C/W @ 200 LFM
Fifanampiana @ menaka : -
Material : Aluminum
Vita ny fitaovana : Blue Anodized

Mety ho liana koa ianao
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-2AB

    Wakefield-Vette

    HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes

  • 122259

    Wakefield-Vette

    HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio

  • TG-CJ-LI-32-32-6-PF

    t-Global Technology

    HEATSINK CER 32X32X6MM W/TAPE.