69-11-42337-T725 Vidiny (USD) [17096pcs Stock]
- 1 pcs$2.41063
- Ampahany:
- 69-11-42337-T725
- Manufacturer:
- Parker Chomerics
- Famaritana antsipirihany:
- THERMAFLOW 28X28MM 18.
- Manufacturer's standard lead time:
- Ao amin'ny staoky
- Fiainana an-trano:
- Iray taona
- Chip From:
- Hong Kong
- RoHS:
- Fomba fandoavam-bola:
-
- Fomba fandefasana:
- Fianakaviana:
- KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Thermal - Fahafahana mangatsiaka, Thermal - Thermoelectric, Peltier Assemblies, Fandroana - Fandroana hafanana, Toeram-piainana, Thermal - Fitaovana, Mpankafy - Akora - kofehy mpankafy, Thermal - Fitaovana, Epoxies, Greases, Pastes, DC mpankafy and Thermal - Mangatsiaka hafanana ...
- Ny tombony azo amin'ny fifaninanana:
- We specialize in Parker Chomerics 69-11-42337-T725 electronic components. 69-11-42337-T725 can be shipped within 24 hours after order. If you have any demands for 69-11-42337-T725, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
69-11-42337-T725 Toetran'ny vokatra
Ampahany :
69-11-42337-T725
Manufacturer :
Parker Chomerics
Description :
THERMAFLOW 28X28MM 18
Series :
THERMFLOW® T725
Ampahany :
Active
Fampiasana :
-
Type :
Gap Filler Pad, Sheet
endrika :
Square
drafitra :
28.00mm x 28.00mm
hateviny :
0.0050" (0.127mm)
Material :
Non-Silicone
Adhesive :
Tacky - Both Sides
Mihemotra, mitondra fiara :
-
Color :
Pink
Famonoan-tena :
-
Fitondran-tena mafana :
-
Mety ho liana koa ianao
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-126
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THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
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CD-02-05-C-22
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THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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CD-02-05-REC-125-N
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