Manufacturer :
Chip Quik Inc.
Description :
LG SOLDER-IN BREADBOARD 1600 PLA
Karazana birao Proto :
Breadboard, General Purpose
voapetaka :
Plated Surface Mount
dity :
0.1" (2.54mm) Grid
Modely :
Pad Per Hole (Round)
Hole Diameter :
0.039" (1.00mm)
Habe / refy :
4.20" L x 4.10" W (106.7mm x 104.1mm)
Biriky ny board :
0.063" (1.60mm)