Panasonic Electronic Components - EYG-S0811ZLWG

KEY Part #: K6153147

EYG-S0811ZLWG Vidiny (USD) [6370pcs Stock]

  • 1 pcs$6.46948
  • 10 pcs$6.11031
  • 25 pcs$5.75113
  • 50 pcs$5.39161
  • 100 pcs$5.03218
  • 250 pcs$4.67272
  • 500 pcs$4.58287

Ampahany:
EYG-S0811ZLWG
Manufacturer:
Panasonic Electronic Components
Famaritana antsipirihany:
THERM PAD 108MMX78MM GRAY. Thermal Interface Products Soft PGS - IGBT Mod Mitsubishi Elec.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Thermal - Fitaovana, Epoxies, Greases, Pastes, Thermal - Fitaovana, Thermal - Fahafahana mangatsiaka, Thermal - Thermoelectric, Peltier Modules, Fans AC, Mpankafy - Akora - kofehy mpankafy, Thermal - Thermoelectric, Peltier Assemblies and Thermal - Fitaovana, Epoxies, Greases, Pastes ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Panasonic Electronic Components EYG-S0811ZLWG electronic components. EYG-S0811ZLWG can be shipped within 24 hours after order. If you have any demands for EYG-S0811ZLWG, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

EYG-S0811ZLWG Toetran'ny vokatra

Ampahany : EYG-S0811ZLWG
Manufacturer : Panasonic Electronic Components
Description : THERM PAD 108MMX78MM GRAY
Series : Soft-PGS
Ampahany : Active
Fampiasana : IGBT - Heat Transfer Low Thermal Resistance
Type : Graphite-Pad, Sheet
endrika : Rectangular
drafitra : 108.00mm x 78.00mm
hateviny : 0.0079" (0.200mm)
Material : Graphite
Adhesive : -
Mihemotra, mitondra fiara : -
Color : Gray
Famonoan-tena : -
Fitondran-tena mafana : 20 W/m-K

Mety ho liana koa ianao
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole