Laird Technologies EMI - 67SLG050060050PI00

KEY Part #: K7358942

67SLG050060050PI00 Vidiny (USD) [423786pcs Stock]

  • 1 pcs$0.08728
  • 850 pcs$0.07864
  • 1,700 pcs$0.07036
  • 2,550 pcs$0.06415
  • 5,950 pcs$0.06001
  • 21,250 pcs$0.05588
  • 42,500 pcs$0.05298

Ampahany:
67SLG050060050PI00
Manufacturer:
Laird Technologies EMI
Famaritana antsipirihany:
METAL FILM OVER FOAM CONTACTS.
Manufacturer's standard lead time:
Ao amin'ny staoky
Fiainana an-trano:
Iray taona
Chip From:
Hong Kong
RoHS:
Fomba fandoavam-bola:
Fomba fandefasana:
Fianakaviana:
KEY Components Co., LTD dia Elektronika Mpanome Elektronika izay manolotra sokajy vokatra ao anatin'izany: Kitapom-bokatra sy fananganana RFID, Boards, Modules Reader RFID, RF Power Controller IC, Amboasary RF, RF Transmitters, RF Directional Coupler, RF mpahazo and Kitapom-bokatra sy kitapo ho an'ny fampandrosoana, ...
Ny tombony azo amin'ny fifaninanana:
We specialize in Laird Technologies EMI 67SLG050060050PI00 electronic components. 67SLG050060050PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG050060050PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG050060050PI00 Toetran'ny vokatra

Ampahany : 67SLG050060050PI00
Manufacturer : Laird Technologies EMI
Description : METAL FILM OVER FOAM CONTACTS
Series : SMD Grounding Metallized
Ampahany : Active
Type : Film Over Foam
endrika : Rectangle
sakany : 0.197" (5.00mm)
Length : 0.197" (5.00mm)
Haavo : 0.236" (6.00mm)
Material : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
voapetaka : -
Fametahana - matevina : -
Fomba fampiakarana : Solder
Ny mari-pana : -40°C ~ 70°C